LUXBEAM® LLS06
6 µm, at 720 wafers an hour
Where fineline PCB and advanced packaging meet: 6 µm line and space from a 405 / 375 nm laser or a 4-peak LED, at the highest throughput in the fine end of the lineup.
LLS06 — in three numbers
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6 µm line and space
Above 90% CD uniformity, with the alignment camera as an option rather than a fixture.
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Laser or 4-peak LED
405 / 375 nm laser, or a switchable 365 / 380 / 395 / 405 nm LED — the first head in the range where the source is a real choice.
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720 wafers an hour
Or 240 panels an hour on 515 × 510 mm. Volume-line throughput at 6 µm.
Where LLS06 fits
Selective advanced packaging
The fine layers of an AP stack, where only some of the panel needs this resolution.
IC substrate and glass build-up
Build-up layers on organic and glass cores, at panel scale.
mSAP SLP
Substrate-like PCB by modified semi-additive process.
HBM RDL
Redistribution for high-bandwidth memory stacks.
Full specification
Imaging & Layout
- Resolution
- 6 µm
- Light source
- 405 / 375 nm laser, or 4-peak LED
- Throughput — Ø300 mm wafer
- 720 wph
- Throughput — 515 × 510 mm panel
- 240 pph
- Typical applications
- Selective AP, IC substrate / glass build-up, mSAP SLP, HBM RDL
- Substrate / panel
- 310×310, 510×515, 600×600
- Segment
- AP / fine-line PCB
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.