LUXBEAM® LLS1000
Maskless Direct Imaging at 1 µm
LLS1000 brings DLP®-based direct imaging down to 1 µm line/space, the resolution semiconductor-adjacent and advanced-packaging lines need, at production throughput. One photohead, integrated into your machine, built in-house from optics to firmware.
In production
1 µm, in real production
The LLS1000 maintains 1 µm line/space resolution at full production throughput. The complete imaging system – from optics to firmware – is in production and shipping today.
What sets it apart
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1 µm resolution
A LASER source and high-NA projection optics resolve down to 1 µm line/space, the resolution semicon-adjacent and advanced-packaging lines demand, at production throughput.
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Stitch-free, in focus
Real-time autofocus and stitch-free imaging hold 1 µm features across the full field, verified by SEM on production resist.
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Vertically integrated
Optics, LASER source, DMD, electronics and the LURIA software stack, engineered under one roof and delivered as one imaging head you mount and drive.
Where LLS1000 fits
1 µm semicon
1 µm line/space on Ø300 wafers for semiconductor-adjacent patterning: MEMS, sensors and emerging device nodes where masks are too slow to iterate.
Advanced packaging
The finest packaging lines (fan-out, RDL and chiplet interconnect) exposed maskless, with die-shift compensation and stitch-free imaging built in.
R&D to production
Change the design at 2 PM, run it at 3 PM. The same photohead carries a process from first silicon through to 24/7 production volume.
Full specification
Imaging & Layout
- Resolution
- 1 µm
- Light source
- 405 / 375 nm laser
- Throughput — Ø300 mm wafer
- ~32 s · 112 wph
- Throughput — 510 × 515 mm panel
- ~110 s/side · 32 pph
- Test substrate
- Resist
- Typical applications
- Finest RDL for CPO and photonic interposers, glass-core fine RDL, mask writing
- Substrate / panel
- Wafers, up to 600×600, glass
- Segment
- Advanced packaging
Integration
- Mechanical mount
- OEM-defined kinematic
- Cooling
- Liquid
- Power
- 24 V DC + aux
- Control interface
- Ethernet (LURIA) · GPIO
- Data path
- 10 GbE pattern streaming
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
- Operating environment
- Class 1000 · 22±2 °C · 45±5 % RH
Throughput measured single-pass on Ø300 mm resist; panel figures on 510×515 mm. Real-world numbers depend on resist and energy density. Consult the datasheet for verified values under your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof: tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging, running 24/7 in PCB, advanced packaging and semicon production worldwide.