LUXBEAM® LLS1000
Maskless Direct Imaging, below 1 µm
LLS1000 brings DLP-based direct imaging into the sub-micron node — the resolution semiconductor-adjacent and advanced-packaging lines need, at production throughput. One photohead, integrated into your machine, built in-house from optics to firmware.
In production
Sub-micron, in real production
The LLS1000 maintains 1 µm line/space resolution at full production throughput. The complete imaging system – from optics to firmware – is in production and shipping today.
What sets it apart
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Sub-micron resolution
A LASER source and high-NA projection optics resolve down to 1 µm line/space — the sub-micron node semicon-adjacent and advanced-packaging lines demand, at production throughput.
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Stitch-free, in focus
Real-time autofocus and stitch-free imaging hold sub-micron features across the full field — verified by SEM on production resist.
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Vertically integrated
Optics, LASER source, DMD, electronics and the LURIA software stack — engineered under one roof and delivered as one imaging head you mount and drive.
Where LLS1000 fits
Sub-µm semicon
1 µm line/space on Ø300 wafers for semiconductor-adjacent patterning — MEMS, sensors and emerging device nodes where masks are too slow to iterate.
Advanced packaging
The finest packaging lines — fan-out, RDL and chiplet interconnect — exposed maskless, with die-shift compensation and stitch-free imaging built in.
R&D to production
Change the design at 2 PM, run it at 3 PM. The same photohead carries a process from first silicon through to 24/7 production volume.
Full specification
Imaging & Layout
- Resolution
- 1 µm
- Light source
- 405 / 375 nm laser
- Throughput — Ø300 mm wafer
- ~32 s · 112 wph
- Throughput — 515 × 510 mm panel
- ~110 s/side · 32 pph
- Test substrate
- Resist
- Typical applications
- Finest RDL for CPO and photonic interposers, glass-core fine RDL, mask writing
- Substrate / panel
- Wafers, up to 600×600, glass
- Segment
- Advanced packaging
Integration
- Mechanical mount
- OEM-defined kinematic
- Cooling
- Liquid
- Power
- 24 V DC + aux
- Control interface
- Ethernet (LURIA) · GPIO
- Data path
- 10 GbE pattern streaming
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
- Operating environment
- Class 1000 · 22±2 °C · 45±5 % RH
Throughput measured single-pass on Ø300 mm resist; panel figures on 515×510 mm. Real-world numbers depend on resist and energy density — consult the datasheet for verified values under your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.