LUXBEAM® LLS15
HDI and fineline PCB at 15 µm
A 405 nm laser or 4-peak LED photohead for HDI, mSAP, inner layer and flex — on 510 × 515 and 600 × 600 mm panels and the large formats PCB production actually runs.
LLS15 — in three numbers
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15 µm line and space
Above 90% CD uniformity, with the alignment camera as an option.
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405 nm laser or 4-peak LED
Pick the source your resist wants: a single laser line, or 365 / 380 / 395 / 405 nm switchable LED.
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About 8 s a side
On a 515 × 510 mm panel — PCB-line cadence at fineline resolution.
Where LLS15 fits
HDI and mSAP
High-density interconnect and modified semi-additive process, at panel scale.
Inner layer and fineline
Inner-layer imaging, and selective fineline where only part of the panel needs it.
RF and antenna-in-package
Geometry where edge definition is the specification.
Flex
Flexible circuits, where the substrate moves and the pattern has to follow it.
Full specification
Imaging & Layout
- Resolution
- 15 µm
- Light source
- 405 nm laser, or 4-peak LED
- Throughput — 515 × 510 mm panel
- ~8 s/side
- Typical applications
- HDI, mSAP, inner layer, fine-line (selective), RF / antenna-in-package, flex
- Substrate / panel
- 510×515, 600×600, large PCB
- Segment
- PCB
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.