LUXBEAM® LLS30
Solder mask and standard PCB at 30 µm
A 405 nm laser or 4-peak LED photohead for the volume end of PCB — solder mask, inner and outer layer, on the largest production panels, at about 8 seconds a side.
LLS30 — in three numbers
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30 µm line and space
Above 90% CD uniformity, across the largest production panel formats.
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405 nm laser or 4-peak LED
A single laser line, or 365 / 380 / 395 / 405 nm switchable LED — whichever your solder mask is formulated for.
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About 8 s a side
On a 515 × 510 mm panel, with no theoretical limit on the panel size itself.
Where LLS30 fits
Direct-imaging solder mask
The highest-volume direct-imaging step there is, with no mask to procure, store or replace.
Standard PCB
Volume production at 30 µm line and space.
Inner and outer layer
Both sides of the stack from one subsystem.
Full specification
Imaging & Layout
- Resolution
- 30 µm
- Light source
- 405 nm laser, or 4-peak LED
- Throughput — 515 × 510 mm panel
- ~8 s/side
- Typical applications
- Solder mask, standard PCB, inner / outer layer
- Substrate / panel
- Largest production panels
- Segment
- PCB
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.