LUXBEAM® BEAM30
Thick copper and power modules at 30 µm
The high-power end of the lineup: a 1–7 channel 4-peak LED photohead for thick-copper PCB, SiC and GaN power modules, high-current substrates and solder mask, on the largest panels.
BEAM30 — in three numbers
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30 µm at high power
Above 90% CD uniformity on the largest panel formats, from the high-power LED source.
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1–7 channel 4-peak LED
365 / 380 / 395 / 405 nm, switchable, with channels scaling the dose for thick resist and heavy copper.
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About 9.5 s a side
On a 515 × 510 mm panel, with no theoretical limit on the panel size itself.
Where BEAM30 fits
Thick-copper PCB
Heavy copper and the thick resist that comes with it, where dose is the whole problem.
SiC and GaN power modules
Wide-bandgap power packaging, on substrates that carry real current.
High-current substrates
Where conductor cross-section, not line width, sets the design.
Solder mask
Direct-imaging solder mask at volume, on the largest production panels.
Full specification
Imaging & Layout
- Resolution
- 30 µm (high power)
- Light source
- 1–7 channel 4-peak LED
- Throughput — 515 × 510 mm panel
- ~9.5 s/side
- Typical applications
- Thick-copper PCB, SiC / GaN power modules, high-current substrates, solder mask
- Substrate / panel
- Largest panels, high power
- Segment
- High power
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.