LUXBEAM® BEAM30
Thick copper and power modules at 30 µm
The high-power end of the lineup: a 1–7 channel 4-peak LED photohead for thick-copper PCB, SiC and GaN power modules, high-current substrates and solder mask, on the largest panels.
What sets it apart
BEAM30 — in three numbers
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30 µm at high power
Above 90% CD uniformity on the largest panel formats, from the high-power LED source.
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1–7 channel 4-peak LED
365 / 380 / 395 / 405 nm, switchable, with channels scaling the dose for thick resist and heavy copper.
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About 9.5 s a side
On a 515 × 510 mm panel, with no theoretical limit on the panel size itself.
Application fit
Where BEAM30 fits
Thick-copper PCB
Heavy copper and the thick resist that comes with it, where dose is the whole problem.
SiC and GaN power modules
Wide-bandgap power packaging, on substrates that carry real current.
High-current substrates
Where conductor cross-section, not line width, sets the design.
Solder mask
Direct-imaging solder mask at volume, on the largest production panels.
Specifications
BEAM30 — at a glance
Imaging & Layout
- Resolution
- 30 µm (high power)
- Light source
- 1–7 channel 4-peak LED
- Throughput — 515 × 510 mm panel
- ~9.5 s/side
- Typical applications
- Thick-copper PCB, SiC / GaN power modules, high-current substrates, solder mask
- Substrate / panel
- Largest panels, high power
- Segment
- High power
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
Why Visitech
We engineer the imaging heart
inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.
Engineered in-house.
Deployed and supported worldwide.
- Years of DLP experience
- 25+
- Systems deployed
- 15 000+
- Field-proven reliability
- 24/7
What is the BEAM30 for
Thick-copper PCB, SiC and GaN power modules, high-current substrates and solder mask at 30 µm line and space — the work where the dose the head can deliver matters more than the finest line it can draw.
How does it differ from the LLS30
Same line width, different source. The BEAM30 is a 1–7 channel 4-peak LED built for high power; the LLS30 offers a 405 nm laser or a single 4-peak LED for standard PCB and solder mask.
Why does high power matter for thick copper
Thick copper needs thick resist, and thick resist needs dose. More LED channels is more optical power at the panel, which is what keeps the exposure time in line with a production cadence.
What throughput should I plan for
About 9.5 seconds a side on a 515 × 510 mm panel. Real numbers depend on your resist and energy density.
Is the BEAM30 a complete machine
No. It is an OEM imaging subsystem you integrate into your own direct-imaging machine, running on the same LURIA platform as the rest of the LLS range.
Not sure which head?
Tell us your line, panel and volume
Send the resist, the target line / space and the format, and a field application engineer comes back with a recommended photohead and a configuration to design around — usually within two business days.
- NorwayHQ · Drammen
- ChinaShanghai
- United StatesAllen, TX
- JapanTokyo