LUXBEAM® LLS02
Advanced packaging at 2 µm
A 405 / 375 nm laser photohead for the finest interconnect outside the sub-micron node — CPO and glass-core RDL, fan-out packaging, MEMS and microfluidics, on wafers and panels up to 510 × 515 mm.
LLS02 — in three numbers
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2 µm line and space
Resolves 2 µm features with CD uniformity above 90%, on wafers and on 310 × 310 and 510 × 515 mm panels.
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Dual-wavelength laser
405 and 375 nm. The shorter line reaches the finest features and works with i-line resists; a standard alignment camera comes with it.
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60 wafers an hour
Single-pass on Ø300 mm, or 20 panels an hour on 515 × 510 mm — production throughput at advanced-packaging resolution.
Where LLS02 fits
CPO and interposer RDL
Co-packaged optics and glass-core interposers, where the redistribution layer sets the density budget.
Fan-out packaging
FOWLP, on wafers and on panel formats up to 510 × 515 mm.
MEMS and microfluidics
Sensor patterning and channel geometry, where the feature and its wall matter equally.
Full specification
Imaging & Layout
- Resolution
- 2 µm
- Light source
- 405 / 375 nm laser
- Throughput — Ø300 mm wafer
- 60 wph
- Throughput — 515 × 510 mm panel
- 20 pph
- Typical applications
- CPO RDL, glass-core / interposer RDL, FOWLP, MEMS, microfluidics
- Substrate / panel
- Wafers, 310×310, 510×515
- Segment
- Advanced packaging
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.