LUXBEAM® LLS02

Advanced packaging at 2 µm

A 405 nm (h-line) / 375 nm (i-line) laser photohead for interconnect down to 2 µm: CPO and glass-core RDL, fan-out packaging, MEMS and microfluidics, on wafers and panels up to 510 × 515 mm.

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A Visitech LUXBEAM® photohead

What sets it apart

LLS02 in three numbers

  • 2 µm line and space

    Resolves 2 µm features with CD uniformity above 90%, on wafers and on 310 × 310 and 510 × 515 mm panels.

  • Dual-wavelength laser

    405 nm (h-line) and 375 nm (i-line). The shorter line reaches the finest features and works with i-line resists; a standard alignment camera comes with it.

  • 60 wafers an hour

    Single-pass on Ø300 mm, or 20 panels an hour on 510 × 515 mm. Production throughput at advanced-packaging resolution.

Application fit

Where LLS02 fits

  • CPO and interposer RDL

    Co-packaged optics and glass-core interposers, where the redistribution layer sets the density budget.

  • Fan-out packaging

    FOWLP, on wafers and on panel formats up to 510 × 515 mm.

  • MEMS and microfluidics

    Sensor patterning and channel geometry, where the feature and its wall matter equally.

Print testing on wafer

Patterned by LLS02, actually imaged

No simulations, no marketing renders. Real microscopy of resist patterned by an LLS02. Open the tile to see the full frame.

  • LLS02 · SEM

    2.0 µm

Specifications

LLS02 at a glance

Imaging & Layout

Resolution
2 µm
Light source
405 nm (h-line) / 375 nm (i-line) laser
Throughput — Ø300 mm wafer
60 wph
Throughput — 510 × 515 mm panel
20 pph
Typical applications
CPO RDL, glass-core / interposer RDL, FOWLP, MEMS, microfluidics
Substrate / panel
Wafers, 310×310, 510×515
Segment
Advanced packaging

Integration

Cooling
Liquid
Pattern formats
GDSII · OASIS · ODB++ · Gerber
Real-time features
Positioning · scaling · rotation · warping · re-routing · autofocus

Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density. Send us both and a field application engineer will verify them for your process.

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Why Visitech

We engineer the imaging heart
inside your next machine

Visitech engineers at work in Drammen
Optics, electronics, light sources, software and firmware, all built in-house.

  • Masks are the past

    Maskless DLP®-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.

  • Vertically integrated

    Every critical element under one roof: tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.

  • Field-proven partner

    The industry standard for high-throughput Direct Imaging, running 24/7 in PCB, advanced packaging and semicon production worldwide.

Stacked LLS photohead production lineup

Engineered in-house.
Deployed and supported worldwide.

Years of DLP experience
25+
Systems deployed
15 000+
Field-proven reliability
24/7

  • What is the finest line an LLS02 can draw

    Two micrometres, line and space, with CD uniformity above 90%. Below that the lineup continues with the LLS1000 at 1 µm; above it, the LLS03 at 3 µm trades resolution for throughput.

  • Which substrates and panel formats does it take

    Wafers, and panels at 310 × 310 and 510 × 515 mm. There is no theoretical maximum panel size across the LLS range. The format is a question about your handling, not about the photohead.

  • Why two wavelengths

    The 405 nm (h-line) wavelength is the workhorse; 375 nm (i-line) is the shorter wavelength for the finest features and for i-line resist compatibility. Both come from the same head, so a process can move between them without a new subsystem.

  • What throughput should I plan for

    Around 60 wafers an hour on Ø300 mm, or 20 panels an hour on 510 × 515 mm, single pass. Real numbers depend on your resist and energy density. Send us both and a field application engineer will confirm them.

  • Is the LLS02 a complete machine

    No. Every LUXBEAM® photohead is an OEM imaging subsystem you integrate into your own direct-imaging machine, running on the LURIA platform shared across the whole LLS range.

Not sure which head?

Tell us your line, panel and volume

Send the resist, the target line / space and the format, and a field application engineer comes back with a recommended photohead and a configuration to design around, usually within two business days.

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  • NorwayHQ · Drammen
  • ChinaShanghai
  • United StatesAllen, TX
  • JapanTokyo