LUXBEAM® LLS02
Advanced packaging at 2 µm
A 405 / 375 nm laser photohead for the finest interconnect outside the sub-micron node — CPO and glass-core RDL, fan-out packaging, MEMS and microfluidics, on wafers and panels up to 510 × 515 mm.
What sets it apart
LLS02 — in three numbers
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2 µm line and space
Resolves 2 µm features with CD uniformity above 90%, on wafers and on 310 × 310 and 510 × 515 mm panels.
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Dual-wavelength laser
405 and 375 nm. The shorter line reaches the finest features and works with i-line resists; a standard alignment camera comes with it.
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60 wafers an hour
Single-pass on Ø300 mm, or 20 panels an hour on 515 × 510 mm — production throughput at advanced-packaging resolution.
Application fit
Where LLS02 fits
CPO and interposer RDL
Co-packaged optics and glass-core interposers, where the redistribution layer sets the density budget.
Fan-out packaging
FOWLP, on wafers and on panel formats up to 510 × 515 mm.
MEMS and microfluidics
Sensor patterning and channel geometry, where the feature and its wall matter equally.
Print testing — on wafer
Patterned by LLS02, actually imaged
No simulations, no marketing renders — real microscopy of resist patterned by an LLS02. Open the tile to see the full frame.
LLS02 · SEM 2.0 µm
Specifications
LLS02 — at a glance
Imaging & Layout
- Resolution
- 2 µm
- Light source
- 405 / 375 nm laser
- Throughput — Ø300 mm wafer
- 60 wph
- Throughput — 515 × 510 mm panel
- 20 pph
- Typical applications
- CPO RDL, glass-core / interposer RDL, FOWLP, MEMS, microfluidics
- Substrate / panel
- Wafers, 310×310, 510×515
- Segment
- Advanced packaging
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
Why Visitech
We engineer the imaging heart
inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.
Engineered in-house.
Deployed and supported worldwide.
- Years of DLP experience
- 25+
- Systems deployed
- 15 000+
- Field-proven reliability
- 24/7
What is the finest line an LLS02 can draw
Two micrometres, line and space, with CD uniformity above 90%. Below that the lineup continues with the LLS1000 at 1 µm; above it, the LLS03 at 3 µm trades resolution for throughput.
Which substrates and panel formats does it take
Wafers, and panels at 310 × 310 and 510 × 515 mm. There is no theoretical maximum panel size across the LLS range — the format is a question about your handling, not about the photohead.
Why two wavelengths
The 405 nm line is the workhorse; 375 nm is the shorter wavelength for the finest features and for i-line resist compatibility. Both come from the same head, so a process can move between them without a new subsystem.
What throughput should I plan for
Around 60 wafers an hour on Ø300 mm, or 20 panels an hour on 515 × 510 mm, single pass. Real numbers depend on your resist and energy density — send us both and a field application engineer will confirm them.
Is the LLS02 a complete machine
No. Every LUXBEAM® photohead is an OEM imaging subsystem you integrate into your own direct-imaging machine, running on the LURIA platform shared across the whole LLS range.
Not sure which head?
Tell us your line, panel and volume
Send the resist, the target line / space and the format, and a field application engineer comes back with a recommended photohead and a configuration to design around — usually within two business days.
- NorwayHQ · Drammen
- ChinaShanghai
- United StatesAllen, TX
- JapanTokyo