LUXBEAM® LLS03
Fine RDL at 3 µm
The advanced-packaging workhorse: 3 µm line and space from a 405 / 375 nm laser, at 102 wafers an hour — redistribution layers, IC substrate and fan-out panel RDL on wafers and panels to 510 × 515 mm.
LLS03 — in three numbers
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3 µm line and space
Above 90% CD uniformity across wafers and 310 × 310 and 510 × 515 mm panels, with a standard alignment camera.
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405 / 375 nm laser
Two wavelengths from one head — the shorter for the finest geometry and i-line resists.
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102 wafers an hour
Or 32 panels an hour on 515 × 510 mm. Three times the LLS02’s throughput, one micrometre coarser.
Where LLS03 fits
RDL and interposers
The density step most advanced-packaging lines actually run, on wafer and on panel.
IC substrate
Build-up layers where line width and registration are both budgeted.
CPO and FOPLP fine RDL
Co-packaged optics, and fan-out panel-level packaging at its finest routing layer.
Full specification
Imaging & Layout
- Resolution
- 3 µm
- Light source
- 405 / 375 nm laser
- Throughput — Ø300 mm wafer
- 102 wph
- Throughput — 515 × 510 mm panel
- 32 pph
- Typical applications
- RDL and interposers, IC substrate, CPO, FOPLP fine RDL
- Substrate / panel
- Wafers, 310×310, 510×515
- Segment
- Advanced packaging
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.