LUXBEAM® LLS03
Fine RDL at 3 µm
The advanced-packaging workhorse: 3 µm line and space from a 405 nm (h-line) / 375 nm (i-line) laser, at 102 wafers an hour, for redistribution layers, IC substrate and fan-out panel RDL on wafers and panels to 510 × 515 mm.
What sets it apart
LLS03 in three numbers
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3 µm line and space
Above 90% CD uniformity across wafers and 310 × 310 and 510 × 515 mm panels, with a standard alignment camera.
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405 / 375 nm laser
Two wavelengths from one head: 405 nm (h-line) and 375 nm (i-line). The shorter is for the finest geometry and i-line resists.
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102 wafers an hour
Or 32 panels an hour on 510 × 515 mm.
Application fit
Where LLS03 fits
RDL and interposers
The density step most advanced-packaging lines actually run, on wafer and on panel.
IC substrate
Build-up layers where line width and registration are both budgeted.
CPO and FOPLP fine RDL
Co-packaged optics, and fan-out panel-level packaging at its finest routing layer.
Print testing on wafer
Patterned by LLS03, actually imaged
Real microscopy of resist patterned by an LLS03. Open a tile to see the full frame.
LLS03 · Optical 3.0 µm
Specifications
LLS03 at a glance
Imaging & Layout
- Resolution
- 3 µm
- Light source
- 405 nm (h-line) / 375 nm (i-line) laser
- Throughput — Ø300 mm wafer
- 102 wph
- Throughput — 510 × 515 mm panel
- 32 pph
- Typical applications
- RDL and interposers, IC substrate, CPO, FOPLP fine RDL
- Substrate / panel
- Wafers, 310×310, 510×515
- Segment
- Advanced packaging
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density. Send us both and a field application engineer will verify them for your process.
Why Visitech
We engineer the imaging heart
inside your next machine
Masks are the past
Maskless DLP®-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof: tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging, running 24/7 in PCB, advanced packaging and semicon production worldwide.
Engineered in-house.
Deployed and supported worldwide.
- Years of DLP experience
- 25+
- Systems deployed
- 15 000+
- Field-proven reliability
- 24/7
Where does the LLS03 sit in the lineup
At 3 µm line and space, between the LLS02 at 2 µm and the LLS05 at 5 µm. It is the head most advanced-packaging lines choose when the finest layer is 3 µm and throughput still has to pay for the tool.
What throughput does it hold
Around 102 wafers an hour on Ø300 mm, or 32 panels an hour on 510 × 515 mm, single pass. Figures are for discussion and confirmed per resist and energy density.
Which formats does it pattern
Wafers, and panels at 310 × 310 and 510 × 515 mm.
Does it come with alignment
Yes, with a standard alignment camera, and real-time die-shift compensation through LURIA. A production panel shifts, rotates and warps as it is processed; LURIA patterns around that rather than assuming it away.
Can a process proven on the LLS03 move to another head
Yes. Every LLS photohead runs the same LURIA platform, so a recipe carries across the range, which is the reason to choose within the lineup rather than between vendors.
Not sure which head?
Tell us your line, panel and volume
Send the resist, the target line / space and the format, and a field application engineer comes back with a recommended photohead and a configuration to design around, usually within two business days.
- NorwayHQ · Drammen
- ChinaShanghai
- United StatesAllen, TX
- JapanTokyo