LUXBEAM® LLS05
Advanced packaging at 5 µm
A 405 / 375 nm laser photohead for AP redistribution and interposers, IC substrate, glass build-up and mSAP fineline — on panels from 310 × 310 up to 600 × 600 mm.
LLS05 — in three numbers
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5 µm line and space
Above 90% CD uniformity, with a standard alignment camera.
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405 / 375 nm laser
Two wavelengths from one head — the shorter for the finest geometry and i-line resists.
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Panels to 600 × 600 mm
310 × 310, 510 × 515 and 600 × 600 mm, so a fineline process scales with the format rather than against it.
Where LLS05 fits
AP RDL and interposers
Redistribution and interposer layers at the density most advanced-packaging lines specify.
IC substrate and glass build-up
Build-up layers on organic and glass cores.
mSAP fineline
Modified semi-additive process at its finest routing layer, on large panel formats.
Full specification
Imaging & Layout
- Resolution
- 5 µm
- Light source
- 405 / 375 nm laser
- Throughput — Ø300 mm wafer
- 132 wph
- Throughput — 515 × 510 mm panel
- 85 pph
- Typical applications
- AP RDL / interposers, IC substrate, glass build-up, mSAP fine-line
- Substrate / panel
- 310×310, 510×515, 600×600
- Segment
- Advanced packaging
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
We engineer the imaging heart inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.