LUXBEAM® LLS05
Advanced packaging at 5 µm
A 405 / 375 nm laser photohead for AP redistribution and interposers, IC substrate, glass build-up and mSAP fineline — on panels from 310 × 310 up to 600 × 600 mm.
What sets it apart
LLS05 — in three numbers
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5 µm line and space
Above 90% CD uniformity, with a standard alignment camera.
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405 / 375 nm laser
Two wavelengths from one head — the shorter for the finest geometry and i-line resists.
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Panels to 600 × 600 mm
310 × 310, 510 × 515 and 600 × 600 mm, so a fineline process scales with the format rather than against it.
Application fit
Where LLS05 fits
AP RDL and interposers
Redistribution and interposer layers at the density most advanced-packaging lines specify.
IC substrate and glass build-up
Build-up layers on organic and glass cores.
mSAP fineline
Modified semi-additive process at its finest routing layer, on large panel formats.
Specifications
LLS05 — at a glance
Imaging & Layout
- Resolution
- 5 µm
- Light source
- 405 / 375 nm laser
- Throughput — Ø300 mm wafer
- 132 wph
- Throughput — 515 × 510 mm panel
- 85 pph
- Typical applications
- AP RDL / interposers, IC substrate, glass build-up, mSAP fine-line
- Substrate / panel
- 310×310, 510×515, 600×600
- Segment
- Advanced packaging
Integration
- Cooling
- Liquid
- Pattern formats
- GDSII · OASIS · ODB++ · Gerber
- Real-time features
- Positioning · scaling · rotation · warping · re-routing · autofocus
Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.
Why Visitech
We engineer the imaging heart
inside your next machine
Masks are the past
Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.
Vertically integrated
Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.
Field-proven partner
The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.
Engineered in-house.
Deployed and supported worldwide.
- Years of DLP experience
- 25+
- Systems deployed
- 15 000+
- Field-proven reliability
- 24/7
Where does the LLS05 sit in the lineup
At 5 µm line and space, between the LLS03 at 3 µm and the LLS06 at 6 µm — the point where advanced packaging meets large-format fineline.
Which panel formats does it take
310 × 310, 510 × 515 and 600 × 600 mm. There is no theoretical maximum panel size across the LLS range.
Laser or LED
Laser — 405 and 375 nm from the same head. The shorter wavelength is what reaches the finest features and what makes i-line resists usable.
How is panel distortion handled
LURIA reads the substrate as it actually is before every exposure and adapts the artwork in real time — repositioning, scaling, rotating, warping and re-routing so every trace lands where it belongs rather than where it was meant to be.
Is the LLS05 a complete machine
No. It is an OEM imaging subsystem you integrate into your own direct-imaging machine.
Not sure which head?
Tell us your line, panel and volume
Send the resist, the target line / space and the format, and a field application engineer comes back with a recommended photohead and a configuration to design around — usually within two business days.
- NorwayHQ · Drammen
- ChinaShanghai
- United StatesAllen, TX
- JapanTokyo