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Additive Manufacturing

Visitech is committed to developing the Additive Manufacturing market and has invested heavily in R&D and manufacturing capacity.

Although 3D printing technology has been around for decades, the availability of solid and durable materials has been the culprit — limiting the market.

The development of new materials and print processes has converted 3D printing into Additive Manufacturing (AM) – volume manufacturing of usable parts made of plastics, ceramics, and metals.

Designers use modern CAD and 3D design tools to shape the most creative forms for future product designs, for which additive manufacturing may be the only solution for reproduction.

  • A greener choice

    A bonus is that additive manufacturing is environmentally friendly. Material waste is scarce compared to traditional machining of parts from material blocks.

  • Fully configurable

    We can configure our patented, scalable, and modular LUXBEAM® Rapid System UV and IR light engines to suit your requirements for wavelengths, pixel sizes, building areas, and throughput.

  • Fewer building area limitations

    Additionally, we offer subsystems that enable you to build high-resolution printing machines combined with vast building areas. Our systems contain light engines, control software, and ready-to-use infrastructures such as calibration cameras and motion systems. Our customers can build real AM machines quickly, with low risk and short time-to-market.

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Direct Imaging Lithography

With our LUXBEAM® Lithography system, we offer a proven product that supports fine-line applications and the manufacturing of energy-efficient electronics.

The consumer electronics market is in constant demand for smaller and smaller devices that consume less power while outputting higher and higher computing power – as seen in mobile phones, smartwatches, and IOT.

For PCB (Printed Circuit Boards), direct imaging lithography’s introduction has replaced conventional exposure machines, coping with increasing accuracy requirements, slimmer linewidth, and smaller space for the conducting material.

  • Reducing cost

    There is a high cost for the semiconductor industry to produce slimmer and slimmer lines to include extended functionality in the same die (ref. Moore’s law). The answer to this is advanced packaging, where multiple dies are interconnected, such as System in Package (SiP).

    Advanced packaging configurations, such as FOPLP, and FOWLP with SiP, create challenges for the fabricators’ manufacturing processes in keeping up sufficient yield.

  • High-yield manufacturing

    The SiP-approach must cope with challenges such as die shift and rotation, and printing the connecting traces from a shifted and rotated unit toward a fixed routing on a panel or wafer. To compensate for these effects, registration and smart warping of the artwork is required.

    Large measurement tools are used to measure all dies and their positions, and thereafter a new layout is calculated and made. The entire process is for that particular panel only – a costly and time-consuming process, prior to the stepper lithography tool, that can print these new lines in the routing.

  • Greater efficiency

    By introducing direct imaging lithography, the warping of the artwork can be done in real-time, milliseconds after the registration is performed. Further features, such as panel data with incremental serial number labelling, is available.

    Visitech has extensive experience with direct imaging lithography. The LUXBEAM® Lithography System (LLS) is available for advanced packaging toolmakers to design tools meeting state-of-the-art 2 or 4 µm line/space requirements.

Ready to scale up your production?

With Visitech inside, we enable your production to be more precise and cost-effective.