We’re at the Moscone Center in San Francisco, Tuesday through Thursday this week, welcoming Semicon West attendants to booth 439. Come by our booth and learn how Visitech’s subsystems can help your next-generation state-of-the-art direct imaging tools achieve better yield and higher precision!
Our LUXBEAM® Lithography System (LLS) is on display, targeting machine builders in Semicon-related industries. This high-resolution direct imaging subsystem provides high throughput capability with a line/space range from 2.5 µm to 30 µm, at low ownership cost and superior lifetime.
Seeking industry partners
Our target at the exhibition is to meet with potential industry partners looking at using direct imaging for their applications within advanced packaging, PCB, and Semicon manufacturing. If this is you, we urge you to take this opportunity to get an in-depth understanding of our systems’ capabilities while at Semicon West.
Your ultimate subsystem
The LLS subsystem is the cumulation of 20 years of experience with Semicon, PCB, and additive manufacturing, where we’ve successfully united cutting-edge optical, hardware, and software design in an ideal and flexible package for Semicon-related industries. As a result, Visitech’s DI subsystems offer multiple advantages over traditional steppers for applications such as FOPLP, FOWLP, and SiP.
Book a meeting now
Our team is looking forward to meeting you this week! If your schedule is busy, you may pre-book a meeting with us using the form below, and you may also browse our LUXBEAM® Lithography System data sheet at your convenience.
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