A high-volume direct imaging subsystem
Target market segments for the subsystem are PCB lithography and advanced packaging, including Semicon and fine line. Tailor-made to master solder mask, inner layer, outer layer, and advanced packaging alike makes the LLS your ultimate subsystem.
LLS06
LLS04
LLS2500
Maximum flexibility
for stable, high-yield manufacturing
on the nanometer scale
Configurable down to 2 μm
Our system provides Direct Imaging solutions down to 2 μm, offering our customers to configure to optimize for optimal quality and throughput for 2-10 μm. This enables our partners to fine-tune to meet process requirements of mass production for common Line/Space requirements such as 2 μm, 5 μm, and 10 μm – and everything in between, with nanometer accuracy.
Throughput.
Having developed world-leading light sources, optics, software, and FW for 20 years, our team fine-tunes all parameters for our customers to achieve optimal throughput for a given application requirement, as we understand that this varies heavily depending on the process. Contact us to discuss your throughput needs!
Low Cost of Operation.
Visitech Photoheads and software provide a low-maintenance, high-throughput, reliable solution with excellent service from our worldwide team of passionate professionals. We will provide you with the necessary resources to ensure uptime.
Flexibility – Scalability
Whether your requirement is MEMS manufacturing, Advanced Packaging requiring advanced packaging techniques, High Density Interconnects, Flip Chip Ball Grid Array (FCBGA), Fan out Panel Level Packaging (FOPLP), Fan out wafer level packaging (FOWLP), Heterogenous chiplets, Flip Chip Chip Scale Package (FCCSP), chip first, chip last, organic substrate, or any other application, contact us for more information on how we can solve your challenges.
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Fineline/Advanced Packaging products?
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