Explore the sub-30-µm world with us
Machine builders and tool makers: Head to hall 3, booth 243, to witness the pinnacle of maskless lithography subsystems for PCB, Fineline, and Advanced Packaging applications. Discover how creating images together with Visitech can be a game-changer for your business!
As we unveil our latest innovations within next-generation Fineline «photoheads» (light engines), we aim to reinforce our subsystems’ solid role in high-end applications such as Advanced Packaging, UHDI, and HDI.
We look forward to discussing the market opportunities you will discover in entering the sub-30-µm world with us and creating the world’s most refined machines and tools for PCB, FOWLP, FOPLP, FPCB – or your unique application.
Meet us in the PCB hall
By catering to our longstanding tradition of meeting up with close partners and customers, our booth is in the PCB hall. But don’t let our location fool you – the innovations we exhibit are truly in the Fineline and next-generation digital light processing (DLP®) field.
See you in Munich, November 14-17!