Direct Imaging · Advanced Packaging

A high-volume direct imaging subsystem

For advanced packaging — fan-out, RDL, bumping and chiplet interconnect, on wafer and panel. Maskless Direct Imaging configurable down to 1 µm line/space, with real-time die-shift compensation and stitch-free imaging.

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  • Direct Imaging in motion
  • Direct Imaging in volume production
  • Built for the fab floor
  • Assembled and tested in-house

Why LUXBEAM® for ADVANCED packaging

A subsystem built for high-volume packaging

  • Configurable resolution

    Direct Imaging configurable across the packaging range — line/space from 6 µm down to 1 µm, matched to your process.

  • Throughput, tuned

    Exposure parameters optimised for the throughput your application needs — tell us the substrate and volume, and we spec to it.

  • Die-shift compensation

    Next-generation software compensates for die shift and warping in real time — on panels and wafers alike.

  • Stitch-free imaging

    Proprietary software removes stitching artefacts entirely — regardless of pattern or substrate size.

  • Substrate flexibility

    Wafers, panels or any required substrate shape — digital data handling and auto-focus, with no fixed size limits.

  • Low cost of operation

    A low-maintenance, high-throughput, reliable subsystem — backed by worldwide support.

Scalability

One subsystem, many processes

The same LUXBEAM® heads scale across packaging and semiconductor-adjacent processes:

  • MEMS
  • Advanced Packaging
  • HDI
  • FCBGA
  • FOPLP
  • FOWLP
  • Heterogeneous chiplets
  • Chip-first / chip-last
  • Organic substrate

Recommended photoheads

Heads for advanced packaging

Five photoheads cover the packaging range, from 6 µm down to 1 µm line/space. Start from the finest line you need to draw, or compare them all in the full spec table.

The LUXBEAM® LLS photohead lineup

lls photoheads suitable for advanced packaging

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Imaged in production

Packaging lines, actually imaged

Real microscopy of resist patterned by LUXBEAM® photoheads on packaging substrates — no renders. Open any tile to see the full frame.

  • Resist · Microscopy

    2 µm L/S

  • LLS02 · Wafer

    2 µm L/S

  • LLS03 · Optical

    3 µm L/S

  • LLS1000 · detail

    < 1 µm edge

  • Which packaging processes does the LUXBEAM® subsystem cover?

    The same heads scale across fan-out (FOPLP/FOWLP), RDL, bumping and heterogeneous chiplet interconnect, plus HDI, FCBGA and MEMS. They image on both wafer and panel, and on chip-first or chip-last flows.

  • What is the finest line/space you can image?

    For advanced packaging, the photoheads run from 6 µm down to 1 µm line/space, configured to your process. The finest head in the range is the LLS1000 at 1 µm. It writes the finest RDL for CPO and photonic interposers, and glass-core fine RDL.

  • Why maskless direct imaging instead of a mask?

    Maskless imaging works directly from digital data, so there is no mask cost and patterns change instantly between jobs. It also lets the software compensate for die shift and warping in real time and image stitch-free — neither of which a fixed mask can do.

  • How is throughput determined?

    Throughput depends on the head, the resolution and the substrate format. As a guide on Ø300 wafers, LLS06 reaches 720 wph at 6 µm and LLS02 runs 60 wph at 2 µm. Tell us the substrate and volume and we spec the exposure to it.

  • Which photohead suits my application?

    Five photoheads cover the packaging range: LLS06 (6 µm), LLS05 (5 µm), LLS03 (3 µm), LLS02 (2 µm) and LLS1000 (1 µm). Start from the finest line you need to draw, then compare them in the full spec table.

  • Can it integrate as an OEM subsystem in our machine?

    Yes — the photoheads are designed as a direct imaging subsystem to build into your platform, with digital data handling and auto-focus and no fixed substrate-size limits. It’s a low-maintenance, reliable building block backed by worldwide support.

Get started

Bring maskless packaging into your line

Tell us the substrate, the target line/space and the format — we’ll come back with a recommended photohead and a configuration, usually within two business days.

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