LUXBEAM® LLS series
Find your photohead
The full LUXBEAM® LLS lineup of direct imaging DLP photoheads, from 30 µm line/space down to 1 µm. Compare resolution, light source and application fit across every head, sorted finest-first.
Specifications
The full lineup, side by side
| LLS1000 | 1 µm | Advanced packaging | Finest RDL for CPO and photonic interposers, glass-core fine RDL, mask writing | Wafers, up to 600×600, glass | 405 / 375 nm laser | Standard | >90% |
|---|---|---|---|---|---|---|---|
| LLS02 | 2 µm | Advanced packaging | CPO RDL, glass-core / interposer RDL, FOWLP, MEMS, microfluidics | Wafers, 310×310, 510×515 | 405 / 375 nm laser | Standard | >90% |
| LLS03 | 3 µm | Advanced packaging | RDL and interposers, IC substrate, CPO, FOPLP fine RDL | Wafers, 310×310, 510×515 | 405 / 375 nm laser | Standard | >90% |
| LLS05 | 5 µm | Advanced packaging | AP RDL / interposers, IC substrate, glass build-up, mSAP fine-line | 310×310, 510×515, 600×600 | 405 / 375 nm laser | Standard | >90% |
| LLS06 | 6 µm | AP / fine-line PCB | Selective AP, IC substrate / glass build-up, mSAP SLP, HBM RDL | 310×310, 510×515, 600×600 | 405 / 375 nm laser, or 4-peak LED | Option | >90% |
| LLS15 | 15 µm | PCB | HDI, mSAP, inner layer, fine-line (selective), RF / antenna-in-package, flex | 510×515, 600×600, large PCB | 405 nm laser, or 4-peak LED | Option | >90% |
| BEAM30 | 30 µm (high power) | High power | Thick-copper PCB, SiC / GaN power modules, high-current substrates, solder mask | Largest panels, high power | 1–7 channel 4-peak LED | — | >90% |
| LLS30 | 30 µm | PCB | Solder mask, standard PCB, inner / outer layer | Largest production panels | 405 nm laser, or 4-peak LED | — | >90% |
Luxbeam Lithography System (LLS) — a direct imaging subsystem for machine builders and tool makers in advanced packaging, PCB, and semiconductor manufacturing. Figures are for discussion and to be confirmed per application.
Common to all photoheads
- Power uniformity
- >99%
- Autofocus
- Real-time, open- or closed-loop (run on the subsystem or fed to the customer's motion controller)
- Depth of focus
- Application dependent, aspect ratio typically 3:1 to 5:1
- Cooling
- Liquid only
- Maximum panel size
- No theoretical limit
- Input formats
- GDSII, OASIS, ODB++, Gerber
- Data adaptation
- Real-time positioning, scaling, rotation, warping, re-routing
- Serialization
- User-defined, unit-level
- Software
- LURIA (see below)
- Wavelength notes
- 4-peak LED = 365 / 380 / 395 / 405 nm, switchable. 375 nm laser = shorter wavelength for finest features and i-line resist compatibility.
Platform
LURIA software
Every LLS photohead runs on LURIA, Visitech’s imaging and control platform. A production panel is never perfect: it shifts, rotates, expands and warps, and the dies inside it move as it is processed.
Rather than fight that variation, LURIA patterns around it. Before every exposure it reads the substrate as it actually is, then adapts the artwork in real time — repositioning, scaling, rotating, warping and re-routing the interconnect so every trace lands where it belongs. Per-pixel power control holds dose uniform across the full field, and sub-pixel positioning places edges finer than the native pixel.
The result is yield where rigid, mask-based exposure loses it: tighter interconnect density, wider process windows, and consistent quality panel after panel. LURIA is the same platform across the entire LLS range, so a process proven on one head carries to the next, and it offers full parameter access through the API.
Key capabilities
- Real-time pattern adaptation
- Real-time die-shift compensation
- Per-pixel power control
- Sub-pixel positioning
- Open- / closed-loop autofocus
- Full API control
Application fit
Which head for which process
REC = recommended · OK = compatible · — = out of range.
| Application | LLS1000 | LLS02 | LLS03 | LLS06 | LLS15 | BEAM30 | LLS30 |
|---|---|---|---|---|---|---|---|
| DI Soldermask · PCB panel | — | — | — | — | OK | REC | REC |
| Inner / Outer Layer PCB | — | — | — | OK | REC | OK | REC |
| HDI · FPCB · fine-line PCB | — | — | — | REC | REC | — | OK |
| White-ink mini-LED soldermask | — | — | — | — | OK | REC | OK |
| FCBGA · FOPLP · FOWLP | — | OK | OK | REC | — | — | — |
| Heterogeneous chiplet · FCCSP | OK | OK | REC | OK | — | — | — |
| Organic substrate · chip-first / chip-last | OK | REC | REC | OK | — | — | — |
| MEMS · sensor patterning | OK | REC | REC | OK | — | — | — |
| Sub-µm semicon patterning | REC | OK | — | — | — | — | — |
How do I pick a photohead from the lineup?
Start from the finest line/space you need to resolve in production, then read across the lineup — every head is sorted by resolution, finest first. Use the full spec table above to compare resolution, light source and throughput across the lineup.
How fine can the LLS series actually draw?
The lineup spans from BEAM30 and LLS30 at ≥ 30 µm line/space for PCB and soldermask down to LLS1000 at 1 µm and finer for sub-micron semicon patterning. In between sit the LLS heads covering HDI, fine-line and advanced packaging.
LED or LASER — which source should I choose?
It follows your resolution and resist. The coarser PCB heads run LED only or dual LASER, LLS15 offers a LASER + LED combination, and every head from LLS06 down to LLS1000 is LASER for the tightest geometries.
How do I compare heads and get the datasheets?
The full spec table above compares resolution, light source and throughput across the whole lineup. Every model links to its product page, where its datasheet can be printed or saved as PDF — throughput figures are verified for your resist and energy density.
Are the photoheads complete machines?
No — the LUXBEAM® photoheads are OEM imaging subsystems you integrate into your own direct-imaging machine, not stand-alone systems. Send us your resist, target line/space and substrate format and a field application engineer comes back with a recommended head and a configuration to design around.
Not sure which head?
Tell us your line, panel and volume
Send the resist, the target line/space and the format, and a field application engineer comes back with a recommended photohead and a configuration — usually within two business days.