lithography · custom applications

Proven platform, configured to your process

We start from the platform behind our PCB, advanced packaging and semicon photoheads, and configure it to your substrate, your stack, your line / space. Tell us the imaging challenge and we’ll spec it.

Let’s configure Talk to an engineer

Where standard configurations fall short

Substrate, exposure, process or scale — any one of these can take a requirement beyond the standard lineup. None takes it beyond the platform. Describe the constraint and we will specify a configuration around it.

  • Non-standard substrates

    Materials, thicknesses or surface topographies outside normal panel and wafer handling.

  • Atypical exposure requirements

    Resist chemistries, layer counts or wavelength needs that sit between our defined segments.

  • Hybrid processes

    Imaging combined with another production step, where the exposure has to fit an existing line rather than the other way around.

  • Constraints of scale

    Footprint, throughput or cost targets that rule out a standard system configuration.

How it works

  • You describe the imaging challenge. What is the result your process has to achieve?
  • We assess it against the platform. With photoheads ranging from 30 µm to 1 µm, with the optics, electronics and software developed in-house, means most of the variables are ours to move.
  • We run a test exposure. Real resist, real microscopy, on your material where possible.
  • You get a specified configuration. Photohead, software and integration path, with figures confirmed for your application.

Get started

Need more details? Let’s talk

Tell us what you need — we’ll come back with a configuration, the options and a timeline.

Talk to an engineer
  • NorwayHQ · Drammen
  • ChinaShanghai
  • United StatesAllen, TX
  • JapanTokyo