Visitech is expanding into semiconductor lithography with the launch of a 1µm L/S-capable system – the LLS1000.
The new direct imaging equipment is built for fan-out wafer-level packaging (FOWLP), fan-out panel-level packaging (FOPLP), and advanced packaging applications. The LLS1000 is a direct imaging subsystem designed from the ground up for toolmakers serving the semiconductor industry. It is compatible with both 405 nm and 375 nm resist applications.
Brand new optical architecture and light source
The LLS1000 is no revision of existing designs. We developed it around a new 4K DLP optics and electronics architecture that introduces a new lens. It includes new laser light sources, positioning the LLS1000 as laser direct imaging equipment. With it, we lay the groundwork for the next generation of UV light engines for machine builders.
To support the tighter tolerances and higher functional density required by advanced packaging formats (such as chiplets and SiP design)
Advanced packaging formats such as chiplets and SiP design require tighter tolerances and higher functional density. As a result, we built the system to support 1µm line/space resolution. The LLS1000 enables tool makers to viably use direct write/imaging as an alternative to steppers, scanners, and mask aligners for 1µm CD resolution.
Built for throughput and precision
Fine feature resolution alone does not solve the packaging industry’s core challenge: manufacturing cost and flexibility. The LLS1000 is designed as a true high-throughput maskless lithography system, part of Visitech’s growing range of high-throughput subsystems aimed at production environments rather than prototyping alone.
The new generation of Visitech’s operating software supports this, offering:
- Industrial-level throughput at 1µm CD resolution
- Stitch-free exposure across the full imaging field
- Positional warping compensation
- Panel warping compensation
Together, these give machine builders and tool makers greater process freedom, with the goal of high yield, high throughput, and robust operation on the production floor.
COMPARING: 2 Um line/space print sample (left) compared with CAD file (right) 2.0 µm
resolution 1.0 µm
Direct industry benefits
Semiconductor manufacturers and tool makers are increasingly under pressure to pack more functionality into smaller packages while keeping production costs under control. Direct imaging lithography, replacing conventional mask-based exposure, is one of the clearest paths to meeting that pressure without sacrificing flexibility, whether the target is wafer direct imaging or panel-based advanced packaging formats.
The LLS1000 extends this approach into direct imaging semicon applications specifically, bringing direct laser lithography to a segment where existing exposure methods struggle to keep pace with shrinking line widths.
RDL interconnect routing 2.0 µm
RDL interconnect routing 2.0 µm
RDL interconnect routing 2.0 µm
With the LLS1000, Visitech leverages its DLP subsystem expertise, built over more than a decade in PCB and advanced packaging, into a platform purpose-built for semiconductor applications.
