Direct Imaging · PCB Inner & Outer Layer
Inner and outer layer imaging for the PCB machines you build
Machine builders come to us for power, speed and throughput, with reliability proven in the field. We build the imaging heart of the machine. LUXBEAM® photoheads image inner and outer layers down to 15 µm line/space, and solder mask on the same platform, with laser or LED.
Inner layer · Outer layer · Solder mask
What the photohead does for inner layer, outer layer and solder mask
Mask-based exposure is rigid: the same phototool has to fit every panel. With a photohead, the artwork is loaded from Gerber or ODB++ production data and adapted to the panel on the stage before each exposure. A new job no longer needs a new phototool. The imaging still has a different job in each process.
Inner layer
The artwork is positioned, scaled and rotated to each panel before exposure, to compensate for shift, expansion and distortion across the panel. CD uniformity is above 90 %, and power uniformity above 99 % with per-pixel power control. LLS15 is specified for inner layer, HDI and mSAP; LLS30 for standard PCB and inner/outer layer.
Outer layer
Warpage is handled by the same pattern adaptation, and open- or closed-loop autofocus runs on the subsystem or feeds your motion controller. An alignment camera is available as an option on LLS15. LLS15 and LLS30 are both specified for outer layer.
Solder mask
Solder mask runs on the two 30 µm heads. LLS30 images solder mask alongside standard PCB and outer layer. BEAM30 is the high-power version, with up to seven 4-peak LED channels in one head, specified for solder mask, white-ink solder mask for mini-LED and thick-copper PCB.
Built for machine builders
One platform to design your machines around
One integration, several machines
LLS15, LLS30, and BEAM30 run on one software platform, with the same interface and full API access, and processes transfer between systems. The machine design around the photohead is yours.
Laser or LED, matched to the resist
LLS15 and LLS30 come with a 405 nm laser or a 4-peak LED. The LED switches between 365, 380, 395 and 405 nm, so the source follows the resist. BEAM30 is specified with a 1–7 channel 4-peak LED.
Built in-house, running in production
We develop the optics, electronics, light sources and software ourselves, so most variables in your machine are ours to move. More than 15 000 Visitech systems are deployed, the LLS runs 24/7 in PCB production worldwide, and our engineers support the integration on site.
Recommended photoheads
Three photoheads for inner layer, outer layer and solder mask
LLS15 is the head for inner and outer layer at 15 µm, including HDI, mSAP and flex. LLS30 takes standard PCB, outer layer and solder mask at 30 µm. BEAM30 is the high-power head for solder mask, white-ink and thick copper. All three are specified at 8 to 9.5 seconds per side on a 515 × 510 mm panel. Below 15 µm, see Advanced Packaging.
LLS photoheads for PCB inner and outer layer
Throughput: 515 × 510 mm panel, seconds per side. Figures are for discussion and to be confirmed per application.
Which head should I design in?
Tell us the process first: inner layer, outer layer or solder mask. Then the resist (type, thickness and dose), the panel size, the finest line/space and its tolerance, the registration requirement, one- or two-sided, and the volume. From that we suggest a head and a configuration. As a rule of thumb: 15 µm inner and outer layer is LLS15, 30 µm standard PCB and solder mask is LLS30, and high-power solder mask or thick copper is BEAM30.
Laser or LED?
LLS15 and LLS30 come with either. The choice usually follows the resist and the price point of the machine. The 4-peak LED is switchable between 365, 380, 395 and 405 nm. BEAM30 is specified with a 1–7 channel 4-peak LED.
What throughput can I plan for?
On a 515 × 510 mm panel, LLS15 and LLS30 are specified at about 8 seconds per side and BEAM30 at about 9.5. Figures are for discussion and to be confirmed per application.
Which panel formats are supported?
LLS15 is specified for 510 × 515 and 600 × 600 mm panels and large PCB formats. LLS30 and BEAM30 cover the largest production panels. There is no theoretical limit on panel size. The LLS is also used reel-to-reel and on flexible PCB.
How much of the integration lands on us?
The LLS arrives as a subsystem: liquid-cooled photohead, a documented interface, full API access and parameter control. It accepts Gerber and ODB++ production data, autofocus runs on the subsystem or feeds your motion controller, and serialization is user-defined at unit level. Motion, handling and the machine frame are yours. Our engineers support the integration on site.
What about registration and uniformity?
CD uniformity is above 90 % across the panel on all three heads, and power uniformity above 99 % with per-pixel power control. The artwork is positioned, scaled and rotated to each panel before exposure, and LLS15 offers an alignment camera as an option. Registration and autofocus data for your panel format are available on request.
Get started
Let’s size the imaging for your next PCB machine
Tell us about the process, the resist, the panel, the line / space and the volume — we’ll come back with a configuration and a timeline.