LUXBEAM® LLS30

Solder mask and standard PCB at 30 µm

A 405 nm laser or 4-peak LED photohead for the volume end of PCB — solder mask, inner and outer layer, on the largest production panels, at about 8 seconds a side.

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A Visitech LUXBEAM® photohead

What sets it apart

LLS30 — in three numbers

  • 30 µm line and space

    Above 90% CD uniformity, across the largest production panel formats.

  • 405 nm laser or 4-peak LED

    A single laser line, or 365 / 380 / 395 / 405 nm switchable LED — whichever your solder mask is formulated for.

  • About 8 s a side

    On a 515 × 510 mm panel, with no theoretical limit on the panel size itself.

Application fit

Where LLS30 fits

  • Direct-imaging solder mask

    The highest-volume direct-imaging step there is, with no mask to procure, store or replace.

  • Standard PCB

    Volume production at 30 µm line and space.

  • Inner and outer layer

    Both sides of the stack from one subsystem.

Specifications

LLS30 — at a glance

Imaging & Layout

Resolution
30 µm
Light source
405 nm laser, or 4-peak LED
Throughput — 515 × 510 mm panel
~8 s/side
Typical applications
Solder mask, standard PCB, inner / outer layer
Substrate / panel
Largest production panels
Segment
PCB

Integration

Cooling
Liquid
Pattern formats
GDSII · OASIS · ODB++ · Gerber
Real-time features
Positioning · scaling · rotation · warping · re-routing · autofocus

Figures are for discussion and to be confirmed per application. Throughput depends on resist and energy density — send us both and a field application engineer will verify them for your process.

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Why Visitech

We engineer the imaging heart
inside your next machine

Visitech engineers at work in Drammen
Optics, electronics, light sources, software and firmware — built in-house.

  • Masks are the past

    Maskless DLP-based exposure means zero physical masks to procure, store or replace. Change the design at 2 PM, run production at 3 PM.

  • Vertically integrated

    Every critical element under one roof — tighter tolerances, faster iteration and complete system optimisation that bolt-together solutions cannot match.

  • Field-proven partner

    The industry standard for high-throughput Direct Imaging — running 24/7 in PCB, advanced packaging and semicon production worldwide.

Stacked LLS photohead production lineup

Engineered in-house.
Deployed and supported worldwide.

Years of DLP experience
25+
Systems deployed
15 000+
Field-proven reliability
24/7

  • What is the LLS30 for

    Solder mask, standard PCB and inner / outer layer imaging at 30 µm line and space — the volume end of the lineup, on the largest production panels.

  • How does it compare with the BEAM30

    Same line width, different source. The LLS30 offers a 405 nm laser or a 4-peak LED; the BEAM30 is a 1–7 channel 4-peak LED built for high-power work — thick copper, power modules and high-current substrates.

  • What throughput should I plan for

    About 8 seconds a side on a 515 × 510 mm panel. Real numbers depend on your solder mask and energy density.

  • Why direct imaging rather than a mask

    The pattern is data, not glass. There is nothing to procure, store, align or replace, high-mix runs need no changeover, and the warping engine corrects every exposure for the panel in front of it.

  • Is the LLS30 a complete machine

    No. It is an OEM imaging subsystem you integrate into your own direct-imaging machine.

Not sure which head?

Tell us your line, panel and volume

Send the resist, the target line / space and the format, and a field application engineer comes back with a recommended photohead and a configuration to design around — usually within two business days.

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  • NorwayHQ · Drammen
  • ChinaShanghai
  • United StatesAllen, TX
  • JapanTokyo